leunghb的个人主页

http://bbs.myboyan.com/u/212576  [收藏] [复制]

leunghb

  • 0

    关注

  • 0

    粉丝

  • 5

    访客

  • 等级:本科生
  • 总积分:21
  • 男,1971-01-01

最后登录:2015-09-19

更多资料

个人标签

暂时没有添加标签!

更多 发表的帖子

MIL-STD-31000A - 26 February 2013 TECHNICAL DATA PACKAGES

2013-09-02 - 回复:1,人气:286 - 美国标准

MIL-STD-31000A - 26 February 2013 TECHNICAL DATA PACKAGES
MIL-STD-750-1 w/CHANGE 2 - 1 July 2013 MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES PART 2: TES

2013-09-02 - 回复:0,人气:136 - 美国标准

MIL-STD-750-1 w/CHANGE 2 - 1 July 2013 MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES PART 2: TE
MIL-STD-750-1 w/CHANGE 2 - 1 July 2013 ENVIRONMENTAL TEST METHODS FOR SEMICONDUCTOR DEVICES PART 1:

2013-09-02 - 回复:0,人气:136 - 美国标准

MIL-STD-750-1 w/CHANGE 2 - 1 July 2013 ENVIRONMENTAL TEST METHODS FOR SEMICONDUCTOR DEVICES PART 1:
MIL-STD-750F w/CHANGE 1 - 29 April 2013 TEST METHODS FOR SEMICONDUCTOR DEVICES

2013-09-02 - 回复:0,人气:301 - 美国标准

MIL-STD-750F w/CHANGE 1 - 29 April 2013 TEST METHODS FOR SEMICONDUCTOR DEVICES
MIL-STD-3010C - 01 August 2013 TEST PROCEDURES FOR PACKAGING MATERIALS AND CONTAINERS

2013-09-02 - 回复:0,人气:172 - 美国标准

MIL-STD-3010C - 01 August 2013 TEST PROCEDURES FOR PACKAGING MATERIALS AND CONTAINERS

回复的帖子

暂无帖子!

留言板

朋友

暂无朋友!

Powered by phpwind v8.7 Certificate Copyright Time now is:08-22 00:03
©2003-2011 博研论坛 版权所有 Gzip enabled 粤ICP备10062441号